SMD and COB
are the main application light sources on the market today. However, with the continuous development of LED power, modularization, low cost, and high reliability, the requirements for packaging technology will become more and more demanding, especially for packaging materials and packaging processes. Packaging technology is more complex, and needs to consider optical, thermal, electrical, structural and other factors, while low thermal resistance, stable packaging materials and novel and excellent packaging structure are still the key to LED packaging technology. However, COB has received more and more attention in recent years due to its low thermal resistance, high luminous flux density, less glare, and uniform illumination. It has been widely used in indoor and outdoor lighting fixtures, such as downlights.
The industry market pays more and more attention to COB, and the industry is divided into different stations. Some think that COB will become the mainstream of light source in the future. Some think that SMD and COB are equally divided, each has its own needs, but the individual manufacturing is different from SMD, but there is no theory of replacement.
Here, the author will compare SMD and COB mainly from five aspects of manufacturing efficiency advantage, low thermal resistance advantage, light quality advantage, application advantage and cost advantage.
SMD and COB products have their own advantages
SMD light source has a large illumination angle of 120-160 degrees, high assembly density, small size and light weight of electronic products. The volume and weight of the patch components are only about 1/10 of that of traditional plug-in components. Generally, after SMT, the electronic The product volume is reduced by 40%-60%, and the weight is reduced by 60%-80%. In addition, it has high reliability and strong anti-vibration capability. Low solder joint defect rate; good high frequency characteristics, reduced electromagnetic and radio frequency interference; easy to achieve automation, improve production efficiency, reduce costs by 30% -50%, save materials, energy, equipment, manpower, time and so on.
The COB packaging technology, that is, the chip-on-board package, is one of the bare chip mounting technologies. The LED chip is placed on the printed circuit board, and the electrical connection between the chip and the substrate is realized by a wire stitching method and covered with a resin to ensure reliability. The COB light source module is a high-power integrated light source. The circuit can be designed according to customer requirements, and the heat dissipation is more reasonable, which can effectively avoid the disadvantages such as spot light and glare of the discrete light source device combination. Less glare, it is also possible to effectively improve the color rendering of the light source by adding a suitable combination of red chips without significantly reducing the efficiency and lifetime of the light source. The viewing angle is large and easy to adjust, reducing the loss of light refraction. More uniform light and easy installation.
1. Manufacturing efficiency advantage
The COB package is basically the same in the production process as the traditional SMD production process. In the solid crystal, the wire bonding process and the SMD package efficiency are basically the same, but in the dispensing, separation, spectroscopic, packaging, the COB package is more efficient than the SMD product. A lot higher, the traditional SMD package labor and manufacturing costs account for about 15% of the material cost, COB packaging labor and manufacturing costs account for about 10% of the material cost. From this data, the COB package is obviously used, and labor and manufacturing costs can be saved by 5%.
2. Low thermal resistance advantage
The thermal resistance of the system in traditional SMD package applications is: chip-solid glue-solder joint-solder paste-copper foil-insulation-aluminum. The thermal resistance of the COB package system is: chip-solid glue-aluminum. Structurally, COB simplifies the production structure compared to SMD, and the thermal resistance of the system is much lower than that of the conventional SMD package, and the life of the LED is greatly improved.
3. Light quality advantage
Traditional SMD packages use a patch to attach multiple discrete devices to a PCB to form a light source component for LED applications. This practice has problems with spotlight, glare, and ghosting. Because the COB package is an integrated package, it is a surface light source with a large viewing angle and easy adjustment, reducing the loss of light refraction.
4. Cost advantage
The traditional SMD package needs to increase the cost of the bracket and solder paste, and increase the cost of the chip and reflow process. The COB package technology directly performs chip packaging on the PCB board, and the material and manufacturing process of the chip holder used by the SMD package technology are eliminated. In the same function of the lighting system, the actual measurement can reduce the cost of the light source by about 30%. The use of COB light source has five advantages over traditional SMD packaged light source, and has great advantages in light source production efficiency, thermal resistance, light quality, application, and cost. The overall cost can be reduced by about 25%, and the device is simple and convenient to use. The process is simple.
SMD package continues to transform into COB
Based on the above advantages, it can be seen that the use of COB light source has five advantages over traditional SMD packaged light source, and has great advantages in light source production efficiency, thermal resistance, light quality, application and cost, and the overall cost can be reduced by about 25%. The use of the device is simple and convenient, and the process flow is simple.
First of all, comparing the production process of the two, it can be seen that the COB light source eliminates the process of patching and reflow soldering on the application side, which greatly reduces the application-side production and manufacturing process, and at the same time saves corresponding equipment and manufacturing equipment. Lower input costs and higher production efficiency. Secondly, from the perspective of cost and application, as LEDs become more and more widely used in lighting, integrated COB packages are increasingly suitable for next-generation LED lighting structures. Developing COB packages also solves the heat in existing SMD package structures. The main way to prevent high problems and high costs. In addition, the number of COB packages will gradually increase in the proportion of LED packages with its excellent performance, especially the increase in the proportion of output value, which further promotes the popularity of LED lighting.
The significant advantages of COB packaging technology in terms of cost, performance, and light quality have laid the technical and market position of COB packaging. And some SMD package manufacturers have been transforming from traditional SMD packaging technology to COB packaging. Of course, due to the tightness of its package, the current COB package is mainly COB surface light source. The main application market is indoor and outdoor lamps, such as spotlights, downlights, ceiling lamps and other indoor applications; street lamps, mining lamps, car lights and other outdoor applications. occasion.
SMD is more extensive than COB applications
According to data from the research center, the market size of the LED packaging industry in 2013 reached 40.3 billion yuan, an increase of 25.94% compared with 32 billion yuan in 2012. Among them, SMD production accounted for 51.9% of the total output, becoming the mainstream packaging form; and COB accounted for 7.7%. However, with the improvement of cost performance, COB packaging has been widely accepted in the field of commercial lighting such as LED spotlights and LED downlights . The demand for COB packaging has been further increased, and the proportion of COB market in the whole year will be further improved. It is estimated that the market size of China's LED packaging industry will reach 53.4 billion yuan in 2014, and the COB market will reach 5 billion.
As we all know, in recent years, COB is mainly used in commercial lighting. In the form of reflectors or lenses, it has become the mainstream solution for directional lighting, such as jewelry lighting and clothing lighting. In addition, the improvement of materials and manufacturing equipment complements the development of COB, which further accelerates the improvement of COB cost performance and shows its advantages in commercial lighting. However, COB also has limitations in applications, and its use in outdoor floodlights, warehouses, and street lamps is not high. Despite this, it still does not stop the trend of COB in the current market. From the exhibitions, shopping, advertising, and product selection, it can be known that it is â€œfavoredâ€ in the light source market.
Therefore, some people in the industry have raised questions: The rising market of COB will pose a threat to the SMD market and enterprises, causing squeeze.
SMD2835 is still the mainstream of the market
COB cannot endanger the patch market, and both products have their own product applications. COB is particularly unique in the field of commercial lighting due to its light profile. Since the development of the patch to the present, from the morphological point of view, although there are new forms such as 3030, 2016, 1616, 1010, etc., 2835 is still the mainstream of the market, but it is continuously optimized in terms of photoelectric performance. COB does not cause squeezing on SMD, and it will not be replaced. Because SMD is still more extensive than COB in the field of application, COB is currently only temporarily used in commercial lighting. According to its disclosure, 3W, 5W, 7W, 10WCOB surface light sources, and 3030, 28351W high power patches have been produced. It is understood that the 3030, 28351W high-power patch produced by the high-power patch is greater than 110LM per W, indicating more than 80 products, widely used in bulbs, spotlights, ceiling lamps and so on.
Impact on traditional packaging? "The caliber is not the same"
The rise of COB will have a certain degree of impact and a greater impact on traditional packaging. SMD will be less and less, and the trend is always on some low-end products, such as in-line LED products. The COB light source is a high-efficiency integrated surface light source technology in which the LED chip is directly attached to the mirror metal substrate with high reflectivity. This technology eliminates the bracket concept, electroless plating, no reflow soldering, and no patching process, so the process is reduced by nearly three points. One of them, the cost is also saved by one third. Undoubtedly, this kind of packaging will impact traditional packaging, but COB is not the only technical solution. The next step is that CSP (chip-scale packaging) technology is getting closer to industrialization, and the cost will be further reduced and the efficiency will be higher. For the CSP technology mentioned in the past two years in the industry "mad pass", there are experts in the industry and enterprises that it is suspected of being a life-saving package. The research institute believes that "free packaging" is also a kind of packaging, but this is a new and advanced technology. As a result, many people in the industry are worried: now that COB and CSP are out, the days of traditional packaging companies are even worse. Both of them will have a serious impact on the traditional packaging market and enterprises. Conversely, COB and CSP will not impact the patch packaging market. According to the current industry development, CSP customers have limited applications, all of which are on high-end products, and there are only a few examples of domestic applications.
Solution: technology upgrade, merger and reorganization, scale efficiency
Whether it is the COB of "Times" or the CSP of "Half a way to kill a bite", some traditional packaging company CEOs said that this will force traditional packaging companies to have to upgrade and upgrade, and will also eliminate the rules, small in the packaging industry. Enterprises are becoming more and more difficult to do, and large enterprises will continue to promote restructuring; after the industry completes the reshuffle, it will eventually leave large-scale enterprises, and the situation of â€œthe big ones will be strong and the strong ones will be strongâ€ will become more obvious.
In order to survive, traditional packaging must be upgraded, and the industry must be merged and reorganized. Because the future will pay more attention to scale and efficiency, the living space of small package enterprises will be further compressed.
The overall characteristics of China's midstream packaging sector is that the barriers to entry are low, the scale of enterprises is small, the number is large, and the market competition is increasingly fierce. According to statistics, the number of packaging companies in 2014 was 1,600, and there were 8 listed companies in the main business, including Changfang Semiconductor, Lehman Optoelectronics, Ruifeng Optoelectronics, Jufei Optoelectronics, Wanrun Technology, Hongli Optoelectronics, Guoxing Optoelectronics, Goer Acoustics. At the same time, some large downstream application companies have set up their own packaging production lines, such as Zhen Mingli Group, Dehao Runda, Qinshang Optoelectronics and so on. In addition, most foreign and Chinese Taiwanese packaging companies have established production bases in China, and the mainland China region has become the world's largest LED packaging production base.
It is estimated that it will be reduced to 1,300 in 2015. Through investigations, it was also found that the proportion of expansion of the large and medium-sized packaging enterprises with a production value of over 100 million in 2014 accounted for more than 60%. It is estimated that by 2015, China's LED packaging scale will exceed 10 billion enterprises, and the speed of mergers and acquisitions will accelerate in the next three years. The small-scale packaging enterprises are facing pressures such as shortage of funds, backward technology and cruel price wars. The marketization and scale of the midstream packaging market are inevitable. The realization of scale requires the integration of the industry chain up and down. On the one hand, it cooperates with chip companies, on the other hand, it enters the downstream application field. According to statistics, more than 90% of packaging companies have entered the downstream application field, and the proportion of applied value is rising. In September 2013, Hongli Optoelectronics acquired a 38% stake in Guangzhou Fo Da Signal for 31.176 million yuan. The acquisition indicates that Hongli Optoelectronics will increase its investment in the future and expand the LED automotive lighting industry.
In addition, with the reform of the IPO â€œRegistration Systemâ€ and the continuous opening of China's capital market, more LED packaging companies will take the landing capital market as their development goal in the future.
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