Infrared thermal imaging technology has become a powerful tool for measuring the surface temperature of electronic components under normal operating conditions. This paper explores the accurate determination of component surface temperatures, focusing on key factors such as background temperature estimation, target temperature evaluation, selection of transparent materials, transmittance calculation, and error analysis with potential correction techniques.
Since 2001, the development of infrared thermal imaging technology has accelerated rapidly. At the same time, thermal management in electronic systems has gained increasing importance. The application of this technology to measure component surface temperatures plays a crucial role in improving cooling efficiency and ensuring system reliability.
Compared to traditional temperature measurement methods, modern infrared cameras offer significant advantages. They allow for fast, non-contact, and non-invasive temperature measurements, while also displaying the full thermal distribution of the measured surface through thermal images. Additionally, their advanced post-processing software provides multiple analytical functions, making them highly versatile for research and development purposes.
As we know, computational fluid dynamics (CFD) simulations are widely used in the thermal analysis and design of electronic products. However, experimental validation is still essential to ensure the accuracy of simulation results. Traditional thermocouples often fail to meet the requirements when measuring non-uniformly heated components. Infrared thermal imaging offers an effective alternative by capturing real-time thermal data without physical contact.
Measuring the true temperature of electronic components using an infrared camera requires careful consideration of emissivity and background temperature. However, in many cases, electronic components are enclosed within a housing, making direct measurement difficult. Some researchers have attempted to use a time-reduction method, where the component is powered off, quickly removed, and imaged. Based on the resulting thermal image, they attempt to estimate the actual temperature under normal operating conditions. While this approach can provide useful insights, it is not always accurate due to the dynamic nature of heat dissipation in real-world scenarios.
To improve accuracy, further research is needed to refine calibration techniques, account for environmental variables, and develop more reliable correction models. With continued advancements in thermal imaging technology, its role in electronic system design and thermal management will only grow in importance.
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