As a new generation of solid-state light sources, Light Emitting Diodes (LEDs) have many advantages such as long life, high efficiency, energy saving, and environmental protection, and are widely used in displays. In the field of lighting, with the development of science and technology, advanced technologies are continuously used in semiconductor production, so that the luminous efficiency of LEDs continues to increase and costs continue to decline.
The core part of the LED is the PN junction. When the injected electrons and holes are combined in the PN junction, the energy is directly converted into light energy. However, not all the converted light energy is enough to be emitted outside the LED. It will be in the PN junction and ring. Oxygen resin/silica gel is converted into heat energy by absorption sheet. This kind of heat energy is a huge side effect to the lamp. If it cannot effectively dissipate heat, the temperature inside the LED will increase. The higher the temperature, the lower the LED's luminous efficiency, and the shorter the life of the LED. In severe cases, LED chips will fail immediately, so heat dissipation is still a huge obstacle to high-power LED applications.
The existing heat dissipation technology existing heat dissipation technology: 101 is a heat-dissipating aluminum profile; 102 is a thermal conductive silicone gasket/silicone; 103-106 aluminum substrate, wherein 103 is an aluminum plate, 104 is an insulating layer, 105 is a copper layer, 106 is The solder masks 201-204 constitute LED lamps, wherein 201 is an electrode, 202 is an LED base, 203 is a PN junction of an LED, 204 is a silicone, and then the solder is used to solder the LED to the copper layer of the aluminum substrate as shown in FIG. As shown by the arrow: The heat emitted by the PN junction of the LED passes through a solder paste layer of the LED base, a copper layer, an insulating layer, an aluminum plate, a thermal conductive silicone gasket, a grease, and a heat-dissipating aluminum profile, which are dissipated in the air, thus completing the heat dissipation process. .
LED base thermal conductivity is about 80W / / mk; solder paste layer thermal conductivity greater than 60W/mk; copper layer thermal conductivity of about 40OW/mk, aluminum plate and aluminum thermal conductivity of about 200W / mk, insulation layer The thermal conductivity is about Iw/mk, and the thermal conductive silicone gasket/silicone is about SW/mk, but the closer the PN junction of the LED is, the higher the heat flux density is, and the thermal conductivity silica gel sheet/silicone grease already has the lateral thermal conductivity of the aluminum sheet. The heat flux density of the insulating layer is much higher than that of the heat-conducting silicone gasket/silicone. Therefore, it can be clearly seen that the heat-dissipation bottleneck lies in the insulating layer of the aluminum substrate.
LED lamp heat dissipation technology since the thermal insulation bottleneck is the insulating layer on the aluminum substrate, then for the thermoelectric separation of the LED, you can use the following new processing technology to deal with aluminum substrate, greatly enhance the LED lamp cooling capacity shown in Figure 2: Under the original LED base of the aluminum substrate, holes are removed from the copper layer and the insulating layer to expose the aluminum plate. However, aluminum cannot be directly soldered. It is also necessary to coat the exposed aluminum plate with a solderable metal layer after repeated studies. To verify and process verification, the following processing techniques are adopted: first, zinc is settling on the exposed aluminum plate, nickel is plated on the zinc surface, copper is then plated on the nickel, and finally tin or gold is applied to the copper. The coating has strong adhesion and good thermal conductivity. After the above plating process, the LED can be welded on the aluminum plate.
After the new aluminum substrate processing process is completed, the heat generated by the LED's PN junction passes through the LED base. A solder paste is welded to an aluminum plate. A thermal conductive silicone gasket/silicone heat-dissipating aluminum profile is dissipated into the air, eliminating the very high thermal conductivity. After a small insulating layer, it is greatly enhanced.
New and old technology LED lamps temperature comparison cooling capacity In order to compare the new technology to enhance the real effect of heat dissipation, we use the old and new processing technology to make two identical models of LED lamps, and test the temperature of each point of the LED lamps under the same conditions, in the new Under the processing technology, the temperature of the LED pedestal in the LED luminaire was significantly reduced by 4.6, which played a very good cooling effect, which can greatly increase the stability and life of the LED luminaire.
The core part of the LED is the PN junction. When the injected electrons and holes are combined in the PN junction, the energy is directly converted into light energy. However, not all the converted light energy is enough to be emitted outside the LED. It will be in the PN junction and ring. Oxygen resin/silica gel is converted into heat energy by absorption sheet. This kind of heat energy is a huge side effect to the lamp. If it cannot effectively dissipate heat, the temperature inside the LED will increase. The higher the temperature, the lower the LED's luminous efficiency, and the shorter the life of the LED. In severe cases, LED chips will fail immediately, so heat dissipation is still a huge obstacle to high-power LED applications.
The existing heat dissipation technology existing heat dissipation technology: 101 is a heat-dissipating aluminum profile; 102 is a thermal conductive silicone gasket/silicone; 103-106 aluminum substrate, wherein 103 is an aluminum plate, 104 is an insulating layer, 105 is a copper layer, 106 is The solder masks 201-204 constitute LED lamps, wherein 201 is an electrode, 202 is an LED base, 203 is a PN junction of an LED, 204 is a silicone, and then the solder is used to solder the LED to the copper layer of the aluminum substrate as shown in FIG. As shown by the arrow: The heat emitted by the PN junction of the LED passes through a solder paste layer of the LED base, a copper layer, an insulating layer, an aluminum plate, a thermal conductive silicone gasket, a grease, and a heat-dissipating aluminum profile, which are dissipated in the air, thus completing the heat dissipation process. .
LED base thermal conductivity is about 80W / / mk; solder paste layer thermal conductivity greater than 60W/mk; copper layer thermal conductivity of about 40OW/mk, aluminum plate and aluminum thermal conductivity of about 200W / mk, insulation layer The thermal conductivity is about Iw/mk, and the thermal conductive silicone gasket/silicone is about SW/mk, but the closer the PN junction of the LED is, the higher the heat flux density is, and the thermal conductivity silica gel sheet/silicone grease already has the lateral thermal conductivity of the aluminum sheet. The heat flux density of the insulating layer is much higher than that of the heat-conducting silicone gasket/silicone. Therefore, it can be clearly seen that the heat-dissipation bottleneck lies in the insulating layer of the aluminum substrate.
LED lamp heat dissipation technology since the thermal insulation bottleneck is the insulating layer on the aluminum substrate, then for the thermoelectric separation of the LED, you can use the following new processing technology to deal with aluminum substrate, greatly enhance the LED lamp cooling capacity shown in Figure 2: Under the original LED base of the aluminum substrate, holes are removed from the copper layer and the insulating layer to expose the aluminum plate. However, aluminum cannot be directly soldered. It is also necessary to coat the exposed aluminum plate with a solderable metal layer after repeated studies. To verify and process verification, the following processing techniques are adopted: first, zinc is settling on the exposed aluminum plate, nickel is plated on the zinc surface, copper is then plated on the nickel, and finally tin or gold is applied to the copper. The coating has strong adhesion and good thermal conductivity. After the above plating process, the LED can be welded on the aluminum plate.
After the new aluminum substrate processing process is completed, the heat generated by the LED's PN junction passes through the LED base. A solder paste is welded to an aluminum plate. A thermal conductive silicone gasket/silicone heat-dissipating aluminum profile is dissipated into the air, eliminating the very high thermal conductivity. After a small insulating layer, it is greatly enhanced.
New and old technology LED lamps temperature comparison cooling capacity In order to compare the new technology to enhance the real effect of heat dissipation, we use the old and new processing technology to make two identical models of LED lamps, and test the temperature of each point of the LED lamps under the same conditions, in the new Under the processing technology, the temperature of the LED pedestal in the LED luminaire was significantly reduced by 4.6, which played a very good cooling effect, which can greatly increase the stability and life of the LED luminaire.
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